JPH0526747Y2 - - Google Patents

Info

Publication number
JPH0526747Y2
JPH0526747Y2 JP1987102559U JP10255987U JPH0526747Y2 JP H0526747 Y2 JPH0526747 Y2 JP H0526747Y2 JP 1987102559 U JP1987102559 U JP 1987102559U JP 10255987 U JP10255987 U JP 10255987U JP H0526747 Y2 JPH0526747 Y2 JP H0526747Y2
Authority
JP
Japan
Prior art keywords
conductive particles
wiring
resin
thermoplastic resin
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987102559U
Other languages
English (en)
Japanese (ja)
Other versions
JPS648734U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987102559U priority Critical patent/JPH0526747Y2/ja
Publication of JPS648734U publication Critical patent/JPS648734U/ja
Application granted granted Critical
Publication of JPH0526747Y2 publication Critical patent/JPH0526747Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive

Landscapes

  • Multi-Conductor Connections (AREA)
  • Wire Bonding (AREA)
JP1987102559U 1987-07-03 1987-07-03 Expired - Lifetime JPH0526747Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987102559U JPH0526747Y2 (en]) 1987-07-03 1987-07-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987102559U JPH0526747Y2 (en]) 1987-07-03 1987-07-03

Publications (2)

Publication Number Publication Date
JPS648734U JPS648734U (en]) 1989-01-18
JPH0526747Y2 true JPH0526747Y2 (en]) 1993-07-07

Family

ID=31332576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987102559U Expired - Lifetime JPH0526747Y2 (en]) 1987-07-03 1987-07-03

Country Status (1)

Country Link
JP (1) JPH0526747Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4669635B2 (ja) * 2001-07-12 2011-04-13 積水化学工業株式会社 微粒子配置導電接続フィルムの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279139A (ja) * 1985-06-04 1986-12-09 Nec Corp 混成集積回路装置

Also Published As

Publication number Publication date
JPS648734U (en]) 1989-01-18

Similar Documents

Publication Publication Date Title
US5561323A (en) Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
JP2570628B2 (ja) 半導体パッケージおよびその製造方法
US5773884A (en) Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
JP2769491B2 (ja) 電気的装置
US5633533A (en) Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
JP2980046B2 (ja) 半導体装置の実装構造および実装方法
JP3838331B2 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP3238004B2 (ja) 半導体装置の製造方法
JPS60262430A (ja) 半導体装置の製造方法
JP2001176918A (ja) テープキャリア型半導体装置、その製造方法及びそれを用いた液晶モジュール
JP3565090B2 (ja) 半導体装置の製造方法
JPH0432541B2 (en])
JP2000277649A (ja) 半導体装置及びその製造方法
JP3847602B2 (ja) 積層型半導体装置及びその製造方法並びに半導体装置搭載マザーボード及び半導体装置搭載マザーボードの製造方法
JPH0526747Y2 (en])
JPH114064A (ja) 異方性導電樹脂及びこれを用いた電子部品の実装構造
JP3519924B2 (ja) 半導体装置の構造及びその製造方法
JP3198162B2 (ja) 半導体集積回路装置の接続方法
KR20040069827A (ko) 반도체 장치 및 반도체 장치의 패키지 방법
US6229222B1 (en) Semiconductor device and method of fabricating the same
JPH0440277Y2 (en])
JP3055189B2 (ja) 液晶パネルとｔａｂテープとの接続方法
JPS63102329A (ja) 半導体集積回路素子実装方法
JP3337922B2 (ja) 半導体装置及びその製造方法
JP2004214373A (ja) バンプ付き半導体素子およびその実装方法